Electronics Forum | Tue Jan 31 17:14:51 EST 2006 | Chris
I would not go by any general rules at all. Test the product! Thermal cycle it and shock and vib test it. Got burned on a part that had 0.010" dia bumps. Manufacturer stated undefill was not necessary on their part due to bump size. I wanted to u
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
Electronics Forum | Wed Aug 22 17:39:19 EDT 2007 | K
I was wondering if there is anyone out there who is soldering the Luxeon Lumiled LEDs into product. We are working on a product that uses them. They are a challenge in that the are SMT parts, but will not withstand reflow temperatures. The manufact
Electronics Forum | Fri Nov 23 12:50:27 EST 2007 | bbarton
Do you have any input as to the vibrations seen on the end-use device? Types of device(s) that have solder joint failure? How many thermal cycles the PCB goes through before failure? There are several areas in production of the board that could be th
Electronics Forum | Thu May 01 09:26:53 EDT 2008 | scottp
Voiding was also the issue I had. I could reduce them substantially by pre-baking the boards, but that's obviously not desirable. Hopefully the chemists have come up with a solution. I extruded some pretty cool looking solder shorts through the vo
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef
Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
.gif)
winsouce.jpg)
