Electronics Forum | Tue Jan 09 13:54:10 EST 2007 | jdengler
Hi All, I'm having a problem with a Fuji GP-341. It has squeegee pressure control using a TEAC TD-320A comparator. I cannot get it to measure printing pressure. On the TD-320A it normally reads "2512" then flips to "oFl4" then back to "2512". If
Electronics Forum | Thu Jan 11 09:19:56 EST 2007 | SMTRework
I know this is not the correct forum to post chip "reworking" questions but you guys have been very helpful in the past. My question is this, when we rework BGA components most of the time the solder reflows at a normal temp and all is well. On occ
Electronics Forum | Wed Jan 17 21:56:57 EST 2007 | fastek
Here's why it all goes to China: Americans all want $100 per hour to change a light bulb yet refuse to pay any more than $10 for a cell phone and $500 for a computer. They only want to work 5 days per week, 7 hours a day and get one month off every
Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL
Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Thu Feb 08 13:22:36 EST 2007 | smtstaff
SMTnet is looking for your input on a problem that has started to become serious... You may have noticed that the forum has had some spam posted... in the past serveral weeks in fact several hundred have been posted. We are soliciting your views a
Electronics Forum | Thu Feb 08 13:23:32 EST 2007 | smtstaff
SMTnet is looking for your input on a problem that has started to become serious... You may have noticed that the forum has had some spam posted... in the past serveral weeks in fact several hundred have been posted. We are soliciting your views a
Electronics Forum | Mon Feb 12 11:13:12 EST 2007 | davef
Q1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? A1. It depends on your current oven. Some ovens can meet the higher t
