Electronics Forum | Tue Apr 13 17:44:29 EDT 1999 | Christopher Lampron
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Mon Apr 19 02:45:31 EDT 1999 | Brian Sloth Bentzen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Mon Mar 30 08:11:22 EST 1998 | Derek Drabenstadt
Does anyone have any experience with fired-silver/platinum/palladium lead terminations soldering. I have had issues on nickel over gold plated boards but not with HASL'd boards with tin/lead pads. Is this the norm?
Electronics Forum | Fri Feb 20 09:41:11 EST 1998 | Chrys Shea
| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre
Electronics Forum | Mon Dec 29 09:50:58 EST 1997 | Bob Willis
I need to find different sources for tin lead bumped die for demonstrations. I require 3000 parts can any one supply details of suppliers Tel, Fax and Email ?
Electronics Forum | Mon Dec 24 09:40:19 EST 2001 | davef
Your peak temperature needs to be 20 to 30�C GT the melting point of the solder. What is the melting point of: * Tamura 60-30 paste? * Tin lead on your connectors? [You imply that it is 63/37, but is that correct?]
Electronics Forum | Tue Nov 19 15:18:28 EST 2002 | gswable
does anyone have concrete data on the reliability of lead free components-SN/Bi used with tin lead paste thanks
Electronics Forum | Wed Feb 20 13:16:06 EST 2002 | pjc
Paste w/ 2% silver has a eutectic temp of 179deg.C vs. 183deg.C for std. 63/37. The 2% can give better wetting in some applications.
Electronics Forum | Mon Apr 29 10:07:00 EDT 2002 | geoff_goring
I need to find out about tin/lead diffusion and how this causes solderability problems in device lead-outs. This is not to be confused with an earlier thread of Zn/Pb diffusion - unfortunately this is was a typo.
Electronics Forum | Tue Sep 30 20:05:34 EDT 2003 | afm
Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor to have non-wetted leads? Lead coating is tin lead 90/10. afm
