Electronics Forum: tinning (Page 158 of 169)

Re: Corroding Solder Joints

Electronics Forum | Tue Dec 28 15:12:03 EST 1999 | Bill Schreiber

Rick, Ultrasonics is a mechanical scrubbing action (cavitation) similar to any other scrubbing action, if you scrub long enough, you stand the chance of wearing away some of the surface material (shiny coating of a solder joint). The shiny coat on a

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su

Re: bare board problem

Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: uBGA's

Electronics Forum | Fri May 14 17:06:18 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: uBGA's

Electronics Forum | Fri May 14 17:06:29 EDT 1999 | Ryan Jennens

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: Specifying Pcb Format/Construction. Help!!

Electronics Forum | Mon Apr 26 16:14:08 EDT 1999 | John W

| Hi Murray! | | Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. | | Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads.

Re: Specifying Pcb Format/Construction. Help!!

Electronics Forum | Tue Apr 27 05:04:50 EDT 1999 | Charles Stringer

| Hi Murray! | | Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. | | Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads.

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach

| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces

Re: IR /Convection Preheats

Electronics Forum | Tue Jan 12 15:11:20 EST 1999 | Earl Moon

| | I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.

Re: Voids - correlation with a not wetting PCB

Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon

| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn


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