Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Fri Dec 08 18:37:01 EST 2000 | Dave F
Asymetry in heating or mechanical forces are the primary reasons for tombstoning regardless of the reflow method. [There's beaucoup of background in the fine SMTnet Archive on reflow tomstoning.] Your situation is curious, but at least you know why
Electronics Forum | Sun Oct 31 11:07:09 EDT 2010 | Mark
http://www.shanelo.co.za/Article%20to%20assist%20with%20Stencil%20Design%20Guidelines.htm Stencil design
Electronics Forum | Wed Apr 19 08:45:33 EDT 2000 | Mark
THE PROBLEM IS DEFINETLY CAUSED BY INCORRECT PAD DESIGN. A FRIEND DID A INVESTIGATION ON TOMBSTONING AND HAS THE CORRECT SIZES.HE CAN BE E-MAILLED AT NMANSON@AFTE.COOKSON .COM OR TEL. 0094 1355 276 500
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT
We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu
Electronics Forum | Thu Nov 02 22:19:32 EST 2000 | Dason C
For 0402 or less, it is prefer to start on the pad design but it doesn't help right now. Senju Metal say that they have develop one of the paste can reduce the tombstoning problem but I don't have chance to test it. Please try and post your finding
Electronics Forum | Fri Nov 03 11:08:29 EST 2000 | Phil
Hi there!!! Actually, all mentioned ideas were significantly related to the cause of tombstoning. But, based on what DL said, you have to check the placement of your 0402. Coz, based on experience, i evaluated the different variables for the root
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