Electronics Forum: underfill removal (Page 1 of 4)

FP4531 underfill rework

Electronics Forum | Tue Jul 26 08:57:23 EDT 2011 | indyc

I am trying to rework FP4531 underfill. Some of the underfill flowed to adjacent capacitor and resistor. Even though the datasheet says that it is non-reworkable, has anyone tried reworking / removing excess underfill? Any information would be help

BGA epoxy removal

Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef

Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w

BGA epoxy removal

Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto

Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml

BGA epoxy removal

Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis

Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t

Underfilled BGA Removal

Electronics Forum | Fri Mar 28 10:11:31 EDT 2014 | davef

hege: beer can opener!!! The ultimate multipurpose tool ... BR davef

Underfilled BGA Removal

Electronics Forum | Fri Mar 28 16:27:43 EDT 2014 | hegemon

Lol Dave. Give me a lever long enough....

Underfilled BGA Removal

Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef

With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef

Underfilled BGA Removal

Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera

My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have

Underfilled BGA Removal

Electronics Forum | Mon Sep 28 13:03:43 EDT 2015 | dyoungquist

The melting point of the solder itself does not change when you have underfill. If the underfill conducts heat better than air, it will take less heat (and/or less time) from your rework station to get the solder up to the melting point. That makes

BGA Underfill Rework

Electronics Forum | Tue Apr 27 15:09:48 EDT 2004 | zymet

Hello Ron, Successful removal of an underfilled BGA requires the use of a reworkable underfill, which Zymet manufactures. For more information on such products, send an inquiry to info@zymet.com. Regards, Carol

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