Electronics Forum: use (Page 1757 of 2490)

Any Recommendations? Lead-Free Reflow Oven and Wave Machine

Electronics Forum | Fri Nov 04 15:02:29 EST 2005 | mo8080

SJ, Let me know if you need any assistacne in financing these machines. We are a bank-owned direct financing source and we specialize in electronic manufacturing equipment. Even if you have a financing company/bank that you always use it never hurts

Help!!

Electronics Forum | Sat Nov 05 01:22:23 EST 2005 | koeka

All, We are having insufficient hole fill only at DIMM connector area(120 pin/row total two or 4 rows at that area) when we switch to lead free (SAC and Sn/Cu). The finish we using is immersion silver. Preheat on top side ~98-118oC. Rosin flux type.

Moisture absorption in the solder paste

Electronics Forum | Mon Nov 07 06:16:59 EST 2005 | laxman

Hi, We have faced the solderability issue (Dewetting and solder balls)in all the Boards after reflow.When we found this issue we discarded the old paste and started using the new paste then for some hours the solderability found to be O.K. After so

Moisture absorption in the solder paste

Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef

We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was

Moisture absorption in the solder paste

Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman

Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill

Reflow issues with leaded paste and mixed components

Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero

Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol

Solder paste control

Electronics Forum | Fri Nov 11 04:40:18 EST 2005 | pavel_murtishev

Good day, First of all used solder paste should be placed in special container. It should be kept separately from �fresh� solder paste from the same jar. Limit paste usage period after opening the jar according to manufacturer�s specification. When

Need Help for EMI Shielding process

Electronics Forum | Fri Nov 11 10:32:12 EST 2005 | davef

Rob: After SAB purchased Pilsner Urquell, they changed from using hops to a extract of hops in their process. They changed the foil on the neck of the bottle from silver to gold at the same time. The result was PU went from THE UNDISPUTED BEST bee

Dip Soldering Advice

Electronics Forum | Tue Nov 15 10:19:27 EST 2005 | James

Can I dip the populated board in flux and achieve good results? Also how easy is it to clean the flux off the board afterwards if it is waterbased? Do you simply brush the board with a damp brush or spray some remover on the board? I also have this q

CP6 Performance

Electronics Forum | Wed Nov 16 08:56:17 EST 2005 | mskler

Hello every one, I will be very thank full to all who are using CP6 fuji machine if they can spare some time for me & give some important information about the machine. 1.What is the actual CPH you are getting during production. 2. W


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