Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Fri Jul 08 12:31:01 EDT 2011 | smtlogics
I am evaluating PACE IR300 rework system for micro BGA having size .85mm x 1.35mm. Is anyone out there has any experience of reworking this package size BGAs. Your comments will be appreciated.
Electronics Forum | Fri Jul 15 18:14:59 EDT 2011 | hegemon
Finetech wopuld be a great machine for this application due to the small component size. Great optics for the alignment. I have no affiliation with Finetech. 'Hege
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Tue Feb 20 13:37:45 EST 2001 | roland
I used the SMTnet search at the top of the page with the keyword "bga" and dropdown component "library" and came up with 14 references. You can also do a search using "BGA" as keyword and "forum" as the dropdown component to get some insight from "t
Electronics Forum | Tue Feb 20 10:47:19 EST 2001 | Massimo
Hi everybody, I need to collect some documentation about BGA rework, in particular I wolud like to know if there are some "theoretical" studies about this matter (for example a finite element model of a BGA suitable to be used to simulate BGA reflow)
