Electronics Forum | Thu Mar 02 23:21:59 EST 2006 | KEN
I recently finished analysis of no-clean fluxes and Ionic contamination and cleaning processes. The results were eye opening. Summary: If you clean a no-clean you better do a good job. Many no-cleans produce a "waxy binder" to encapsulate the tro
Electronics Forum | Sat Mar 03 23:24:55 EST 2001 | CAL
We test Parts and Components to IPC J-std-002/003. We also use a wetting Balance tester to determine solderability. We also test with SERA. We use ROSA to electrochemically revert the components back to their original state. Need more info ... email
Electronics Forum | Wed Jun 30 19:31:40 EDT 2010 | jry74
Tim, try and incorporate an inline wash system. We use one with a surfactant and it cleans the "NO CLEAN" fluxes well. If you dont have an inline system, you can manual clean the boards with an surfactant and IPA. You can also do an ionic contamin
Electronics Forum | Wed May 27 12:32:15 EDT 1998 | Earl Moon
| | | | | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | |
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Electronics Forum | Fri Oct 19 11:51:25 EDT 2007 | rgduval
By definition, no clean solder can be not-cleaned. The solder/flux are formulated to result in low ionic-contamination, hence, no cleaning. I have, however, always had at least one customer that requests their no-clean solder get cleaned. No-clean
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Wed Jan 27 21:02:53 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Thu Jan 28 08:58:10 EST 1999 | Peet
| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe
Electronics Forum | Wed May 27 08:46:25 EDT 1998 | Dave F
| | | | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | | |
