Electronics Forum: vacuum package (Page 3 of 13)

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

RoHS Board Delamination

Electronics Forum | Tue Oct 24 09:35:33 EDT 2006 | jax

The need to Pre-Bake depends on multiple variables: 1. Packaging from the vendor (dry packs, vacuum sealed, etc...) 2. Storage at your facility (temp, humidity, etc...) 3. Moisture absortion rate of Laminate (FR406BC is one of the highest) Other rea

MyData Missing Placements

Electronics Forum | Thu Jul 12 07:38:23 EDT 2007 | avalancher

Hey Sr, I agree that 130 is enough to pull a tiny little 0402, but I think that your forgetting response time. The machine has a small reservoir built in the system that keeps some moderate standing vacuum, however, when a part is picked, there

Has anyone looked into Vacuum storage on moisture sensitive devi

Electronics Forum | Tue Aug 19 09:09:15 EDT 2003 | D Peter

After a few problems and time constraints on baking moisture sensitive devices, we are looking at solutions to storage rather than going after a rebaking solution. One thing that always bothered me about baking was the oxidation on the lead finish,

Baking components at 70 degree

Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech

Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Re: Packaging of moisture sensitive devices

Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C

Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to

Moisture Sensative Components

Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc

There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik

moisture sensitive components/packaging

Electronics Forum | Wed Sep 23 10:42:13 EDT 2015 | ehess

is it necessary to vacuum seal moisture sensitive components? Or can we just seal with desiccant in proper bags?

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Fri Mar 17 21:38:55 EDT 2017 | jlawson

I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not r


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