Electronics Forum: via hole on solder pads (Page 1 of 24)

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 00:25:28 EDT 2011 | alcatel

I have one pcb which has via holes on both solder pads of 0402 chips. Right now im using type 3 solder paste with 45 degree squeegee. and a lot of these chips are tombstoning. Im guessing with larger particle size of solder paste, the solder will

Dealing with BGA solder ball in via hole

Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar

I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef

Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 07:27:11 EDT 2011 | scottp

You need to post a picture or describe your geometry better. Is this a through hole via in pad or is the via offset from the pad with no soldermask in between?

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:08 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:40 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 14:50:09 EDT 2011 | kahrpr

Try shifting the placement location slightly toward the pad that is not soldered. This is assuming it is always standing up on the same pad

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef

Can you jumper the via to the pad?

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar

That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?

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