Electronics Forum | Thu Jan 19 12:38:03 EST 2012 | cobham1
I am wondering if the failurs that people see are discovered right away or when the units are out in the field. Reason I ask this follow up question is the units that are having problems are all returns from our customers. Is there a way to check for
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Mon Jan 31 08:30:41 EST 2005 | davef
Yes, probing via is perfectly acceptable. Via: * Pad diameter is 0.028 inch * Via pitch minimum is 0.50 inch ... all of which is fairly common, even when probing test pads. [Your English is fine, at least as good a half the English speakers here.]
Electronics Forum | Wed Apr 15 10:27:20 EDT 2009 | mbohuslav
I am trying to find out what would be considered the minimum test via that would be considered reliable for Flying Probe testers. Specifically Javelin testers. Also what would the minimum annular ring need to be.
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Fri Apr 27 10:38:30 EDT 2007 | pjc
No dome needed. You should check what type probe you have. You can look here and consult with them: http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT
Electronics Forum | Thu Apr 16 22:15:42 EDT 2009 | davef
For general flying probe test guidelines, look here: http://www.testcoachcorp.com/finnProducts/downloads/DFT/DFT.pdf For specific guideles, follow the advice of your equipment supplier. We have no relationship, nor receive benefit from the company
Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram
We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.
Electronics Forum | Thu Sep 21 10:34:20 EDT 2006 | Kerwin Hooshey
Is there an ICT probe style that can pierce through tented (closed) via's?
