Electronics Forum | Thu Mar 18 22:01:46 EST 1999 | Dave F
100 sec) and decrease reflow temp to 205C.
Electronics Forum | Mon Jun 14 14:43:37 EDT 2010 | chrisatae
Thanks Justin. This is a big help. Chris C
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did
Electronics Forum | Wed May 07 08:10:22 EDT 2003 | Pon
Hi all Are there any advice pls. let me know. Our customer Void spec. at BGA and CSP is less than 10%. Usually we found void defect at BGA and CSP component around 2-3 % but sone lot the defect rate is up to 18%. I have read some input from this w
Electronics Forum | Wed Nov 21 10:41:03 EST 2001 | arzu
Hello, Sometimes you have no choice other than putting uvias in ubga's-pads. I know examples of high-end mass production of products with ubgas having voids. (no problems, but always voids visable in x-ray) I also performed a DOE a while ago to avoid
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Electronics Forum | Thu Apr 23 00:27:06 EDT 2009 | josephkhiew
25% void (total pcba inspected is 15 boards, each board has 2 BGAs and each BGA has 64 balls). Referring IPC-7095 stated that there is no evidence or empirical data that indicates that voids within ball will cause failure. We would appreciate if y
Electronics Forum | Tue Oct 08 09:51:10 EDT 2002 | larryk
Russ, I use the R562, it has a longer tack time then the Hm531 and have found no problems with voiding on my BGAs. You may want to evaluate this formula also Larry
Electronics Forum | Wed Jun 17 15:20:18 EDT 2020 | rsatmech
Thank you for your valuable inputs. Current two SMT line is running and I have initiated to use two different pcb suppliers in each line. Do I need to check the plating details in issue pcba or random pcb. Kindly suggest.
