Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Electronics Forum | Mon Sep 14 18:40:39 EDT 2020 | dwl
A reflow oven with Center rail support can help. If your volumes are too low to justify spending $$ on a proper carrier, titanium stiffeners applied to the PCB before it goes into reflow is a cheap, albeit manual solution.
Electronics Forum | Mon May 22 09:13:12 EDT 2000 | Wolfgang Busko
Hi Sal, I don�t have the solution to your problems but my first thought is warpage. I�ve seen similar things caused by exessive warpage of PCBs 1,6mm thick sometimes and with 0,8mm and T-SOP 50% showed this symptom. Prebaking and a fixture to counte
Electronics Forum | Tue Aug 22 13:04:04 EDT 2000 | Eugene Smelik
Dr. Lee, Given the higher reflow temperatures for Pb-Free assembly, will common FR4 laminate materials be adequate, or do you believe that higher glass content boards will be required for mainstream Pb-free assembly? As a corollary question - if man
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Wed Jan 29 08:32:48 EST 2020 | dontfeedphils
I'm currently running Grid-Lok in my printer and have used it almost exclusively in the past. That being said, I'm looking for a solution to help correct/remove sag and warpage on PCBs that will run through our TRI SPI and AOI. I have no doubt th
Electronics Forum | Mon Apr 24 09:43:47 EDT 2006 | printerman
What you describe is the X snuggers fitted into the workholder which do need either a flat board or good vacuum to work. There are several solutions. One solution you can try yourself is to use Vacuum cups, ( bellows type) designed into the workholde
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Fri Aug 20 12:41:20 EDT 1999 | stefano bolleri
| | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | This is what I did. | | | | Created a removal pr
Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
