Electronics Forum | Thu Mar 17 09:56:34 EST 2005 | jmedernach
Tx, Your spec limit is the point at which you expect to see a failure. In other words, what is the probability that you'll see a short when you have .008" of solder paste? What is the probability that you'll see an open if you have .004" of solder
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Thu Mar 17 09:34:10 EST 2005 | sumxp
What is the spec limit setting for solder paste height control in your area.Is it +/-2mils for 6 mils stencil? Tx
Electronics Forum | Sat Nov 25 22:24:42 EST 2017 | hemant_pang
Hi , Can anybody knows about PTS system Singapore who manufacturer of solder paste height inspection machine ZC 1000, we need control card of the machine, not able to get contact information of manufacturer Please share if you have some info
Electronics Forum | Tue Feb 22 08:40:12 EST 2005 | JB
A couple of features on your stencil printer that should help with a couple of potential printing processes: A temperature control unit and the automatic understencil cleaning with the chemical of your choice. That alone, will reduce the chances of
Electronics Forum | Thu Oct 27 07:57:35 EDT 2005 | Bob R.
Nearly all of our assemblies have to meet class 3 requirements and we regularly use 5 and 6 mil stencils. If you've got reasonably well controlled processes you won't have any trouble getting class 3 joints on QFPs and discretes.
Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
