Electronics Forum | Thu Apr 11 12:10:14 EDT 2002 | jax
Different Solder types are not needed. Surface tension will hold most. Plenty of info in the archives about reflow profiles, weight limitations, etc...
Electronics Forum | Fri May 24 14:42:35 EDT 2013 | dilogic
Google for this: "weight_limit_qfn_smta.pdf" Although it is focused on QFN, formula can be used for most parts...
Electronics Forum | Wed Jun 11 15:30:05 EDT 2008 | jax
Don't waste your time. Allowable limits are not measured using the % weight of the entire assembly.
Electronics Forum | Tue Sep 13 01:52:53 EDT 2011 | SheanDalton
My recollection is that RoHS limits for lead is 0.1% of the weight of any homogeneous material in the assembly.
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Fri Jul 24 02:32:35 EDT 1998 | Frank J. de Klein
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Tue Oct 11 11:54:36 EDT 2011 | Shean Dalton
There are aerosol spray on flux removers that contain Trichloroethylene. There are also many other flux removers on the market. Recommend you explore more options. To help get an answer quickly, you can contact Zestron, Kyzen, Petroferm, etc; an
Electronics Forum | Tue Feb 20 07:31:45 EST 2001 | Nick L
0.076 ~ 0.2 um(micron) but our substrate gold thickness is between 0.3~1.2um. Is there any related to the plating process of substrate! And how can they control this thickness?(May be I should ask substrate vendor their controlling limit). If this i
Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
