Electronics Forum | Thu Jun 26 20:54:08 EDT 2008 | davef
As pointed-out above, the downside of telling your supplier how to perform a process can create problems: * It sets the cost of the operation ... I did what you told me to do * Materials selected may be incompatible ... I did what you told me to do *
Electronics Forum | Thu Jun 26 13:55:56 EDT 2008 | dyoungquist
Water will not remove no clean flux residues because they are not water soluble. Solder paste with no clean flux should only be used when the assemblies do not need to be cleaned. That said, you can buy special cleaning solvents specifically for re
Electronics Forum | Thu Jun 26 12:53:54 EDT 2008 | dwelch123
Tell your assembler they shouldn't wash no clean paste,they will have to use a part stretcher to get parts to fit back on pads!!!??????????????
Electronics Forum | Thu Jun 26 10:02:06 EDT 2008 | rdnggbsss1
I am a PCB Designer and I have to put a note on the assembly drawing to tell the assembler how to clean the board. This is new to me. Here is a sample note. Can someone give me some feedback on it? "Use water washable, no clean solder paste for t
Electronics Forum | Thu May 11 16:48:57 EDT 2006 | patrickbruneel
In all fairness no one has the answer for you, non of the lead-free alloys has been long enough in use or have supporting long-term reliability data. No matter what alloy you will use, your company will be at risk, that�s why so many exemptions are a
Electronics Forum | Thu May 11 08:27:15 EDT 2006 | timnop
We will be receiving our lead free wave solder machine soon and I have been doing a lot of reading here. I've seen many dicussions about SAC vs. SN100C for wave applications and am leaning heavily towards the SN100C for my process. I haven't seen any
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Tue Aug 21 03:42:55 EDT 2001 | mugen
SMT community, My Fellows, 1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? 2) why is water-soluble (WS) not a hot choice? 3) All I know, *is in layman terms*, that BGA has tendency to trap water, should WS process be the c
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Fri Aug 22 13:10:51 EDT 2008 | bschreiber
The folowing articles are available at: http://www.smartsonic.com/article.html "Why Not Ultrasonic Cleaning?" by William Kenyon "Damage-Free Ultrasonically-Assisted Cleaning of Printed Circuit Assemblies" - by B.P. Richards et al "Does Ultrason
