Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Wed May 22 10:14:08 EDT 2019 | emeto
Matt, we did the study and YES perpendicular to the V-score is the worst case scenario. We did a cross section and confirmed component is cracked. If you don't have power over PCB design, the easiest way is to change board panelization or even order
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Fri Jul 23 05:14:40 EDT 2004 | greg york
Hi Thomas Ever considered that this maybe HASL flux left on PCB as this is extremely hygroscopic and has heat transfer fluids that cannot be baked out unless you go to a temperature of around 600C. One way of testing is to leave iron tip on joint an
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Wed Sep 10 14:14:03 EDT 2008 | gregoryyork
Yes why did the Electroless Nickel layer split this is the ROOT cause. My guess is still that the resist was slightly miss registered over the copper and therefore poor adhesion of the Nickel ensued OR like I said originally the resist had contaminat
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Mon Oct 18 05:23:01 EDT 1999 | Brian
Steve What do you mean by better? More/less activity? fewer retouches? longer shelf life at ambient temperature? less hygroscopicity? longer open time on the stencil? easier to wash? easier to treat waste water? easier for washing machine maintenanc
Electronics Forum | Wed Feb 25 09:22:53 EST 1998 | Earl Moon
PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'
Electronics Forum | Wed Feb 25 09:21:05 EST 1998 | Earl Moon
PCB Fabrication Supplier Evaluation And Qualification Made Easier Supplier evaluation and qualification often is left to uninformed industry references or vague suggestions made by sales unprofessionals. This discussion is met to enhance a customer'
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