PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMTECHCER&PN=550L104KTT
: Surface Mount Logical Description: Capacitor, Ultra-Broadband, 0.1uF, 16V, 10% Physical Description: Capacitor, Chip; 1.016 mm L X 0.508 mm W X 0.61 mm H body Manufacturer
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMTECHCER&PN=530L104KT16T
: Active Updated: 5/11/2021 11:44:00 PM Mounting Type: Surface Mount Logical Description: Capacitor, Multilayer Ceramic, 0.10uF, 16V Physical Description: Capacitor, Chip; 1.016 mm L X 0.508 mm W X 0.61 mm H body Commonly Visited
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2016-02-17
producing a range of structures. These include standard multi-layer, medium-barrier, and high-barrier sheet with thicknesses from 180 to 1,016 µ (0.180 to 1.016 mm
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/polymer-processing-systems/news/news/2016-02-17
média com espessuras de 180 a 1.016 µ (0,18 a 1,016 mm). Como as estruturas das lâminas de barreira frequentemente são assimétricas, a espessura dos materiais ou da camada acima da camada central difere daquelas abaixo dela
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/polymer-processing-systems/news/news/2016-02-17
sistema di coestrusione Nordson EDI per la produzione di tutta una gamma di strutture diversificate, tra le quali: fogli multistrato standard e fogli barriera media ed elevata, con spessori che vanno da 180 a 1.016 µ (da 0,180 a 1,016 mm
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/zh-CN/divisions/polymer-processing-systems/news/news/2016-02-17
产热成型片材的制造商。该公司最近安装了一套 Nordson Extrusion Dies Industries 共挤模头系统，用于生产一系列不同结构的产品。这些产品包括厚度从 180 微米到 1,016 微米（0.180 毫米到 1.016 毫米）的标准多层、中阻隔和高阻隔片材。此类阻隔片材结构往往是非对称的，即在中间层以上的材料或层厚与该层以下的材料或层厚并不相同。这套 Nordson Extrusion Dies Industries
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