25 acceptable voids results

What Are Lamination Voids in PCB Manufacturing? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/

What Are Lamination Voids in PCB Manufacturing? | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications

Imagineering, Inc.

Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/

Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

: Air Temperature:240°C Small Voids but within Acceptable Limits BGA Cross Section PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 15 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 7 Material: Tin Silver Atmosphere

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

: Air Temperature:240°C Small Voids but within Acceptable Limits BGA Cross Section PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 15 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 7 Material: Tin Silver Atmosphere

Heller Industries Inc.

Ask Helena & Leo (4)

| https://www.eptac.com/faqs/ask-helena-leo/page/4

? Also, how do you avoid bubbles in the coating? Read More Vapor Phase Soldering to Immersion Tin Plated Pads QUESTION Question: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process

” box 3 Interpreting IPC-A-600 The Requirements for Annular Rings and Laminate Cracks 4 Acceptable or Non Conforming? 5 Definitions   Make the distinction between

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_07_21_10.pdf

” •  Section 7.5.14.2 added following “…Voiding criteria for components with non-collapsing type of balls is not established.” and added Note 1 on Voids 8 001 Overview of major changes Section 9.1.3, 9.1.4, 9.1.5

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_05_18_16.pdf

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components

Issues of Burnt Flux on Class 3 PCB Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/issues-of-burnt-flux-on-class-3-pcb-assemblies/

: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition

Accept or Reject: Solder Contacting Component Bodies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/

. Sections are shown below. Is this condition acceptable under any circumstances, or is it always a reject in all three classes? More SolderTips SolderTip #36