ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/about/news/sonolab-welcomes-dage-x-ray-tool
. Our combination of manual and automated x-ray inspection, bond testing, automated optical inspection and acoustic micro imaging solutions help our customers set the standard for successful
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2593&OB=DESC.html
. The smallest visible markings range from 0.30 mm – 0.40 mm and are typically used for micro-miniature packages or very dense part placement PCB layouts
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2593&OB=ASC.html
. The smallest visible markings range from 0.30 mm – 0.40 mm and are typically used for micro-miniature packages or very dense part placement PCB layouts
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2593&OB=DESC.html
. The smallest visible markings range from 0.30 mm – 0.40 mm and are typically used for micro-miniature packages or very dense part placement PCB layouts
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/semiconductor-packaging
. The system offers single- or simultaneous dual-valve dispensing, micro-dot jetting up to 1,000 Hz frequency and 1,800,000 dots/hr, narrow-gap stream widths of < 175
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA) and MicroBGA often call for voiding under 20%. A low-void solder paste is required to meet the very low-voiding limits for Class 3 assemblies. UV-traceable flux
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Low-void IPC-7097A is the Specification for the Design and Assembly Process Implementation for BGAs. The inspection criteria for Ball Grid Array (BGA
