| https://www.eptac.com/blog/the-5-essential-tools-for-soldering
. Just remember that cleaning the tip after each session is important. Soldering Wick Nobody is perfect, and mistakes are bound to happen
| http://etasmt.com:9060/te_news_industry/2019-06-13/6961.chtml
. Reflow soldering machine: refers to soldering a solder paste previously coated on a pad by heating to electrically interconnect the leads or solder terminals of the electronic components pre-applied on the pads and the pads on the pcb
| http://etasmt.com/te_news_industry/2019-06-13/6961.chtml
. Reflow soldering machine: refers to soldering a solder paste previously coated on a pad by heating to electrically interconnect the leads or solder terminals of the electronic components pre-applied on the pads and the pads on the pcb
Blackfox Training Institute, LLC | https://www.blackfox.com/beginners-guide-to-surface-mount-soldering/
. Instead of components with leads inserted into holes as with “Through Hole” soldering, in this technique, components are attached to the pads on the board surface
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/beginners-guide-to-surface-mount-soldering/
’ Guide To Surface Mount Soldering Surface Mount Soldering is a commonly used technique in the Surface Mount Technology (SMT) assembly process. Instead of components with leads inserted into holes as with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
Custom Interconnect Limited Installs Latest Nordson SELECT Novo 460PD Selective Soldering System SELECT Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Overview - All Novo 460 Cerno
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| https://www.eptac.com/ask/gullwing-lead-deformation/
. The 001 Handbook states on page 58, section 7.1.1 Lead Deformation: “After forming, component leads may be deformed up to 10% of the diameter, width, or thickness, and still be acceptable for use
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