Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
) diameter solderball Sn63 solder paste Test vehicle: 1.57mm thick (62 mil), FR-4, 2 internal planes Thermal cycling: 0°C-100°C, 5 minute dwells, 10 minute ramps, 8000
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_cr_technology_crx2000_xray.html
CR Technology CRX 2000 CR Technology CRX2000 Xray Equipment Description CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Solder joint quality
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
• The true process window for Lead Free Solder is 10 - 20°C less than standard eutectic tin lead • Delta T on the PCB becomes critical
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
• The true process window for Lead Free Solder is 10 - 20°C less than standard eutectic tin lead • Delta T on the PCB becomes critical
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
) SnPb 195 205 215 TAL (sec.) 30 60 90 Table 2. Solder Paste, Components, and Board in the Experiment Solder Paste Components & metallization Board metallization SAC305, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
) SnPb 195 205 215 TAL (sec.) 30 60 90 Table 2. Solder Paste, Components, and Board in the Experiment Solder Paste Components & metallization Board metallization SAC305, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
) in Avionics Environments" 2002: Fay Hua, Raiyo Aspandiar, Tim Rothman, Cameron Anderson, Greg Clemmons, and Mimi Klier, Intel Corporation "Solder Joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic Pb-Sn Solder Paste" 2001: Dr
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
) excessive pad size vs. the part’s terminal size, leading to the same effect. Te m p er at ur e (° C ) Preheat Preflow Reflow Cooldown Dwell at Liquidus 20 to 70 sec Dwell at Liquidus 20 to 60 sec 230 230 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 to 3 min 3.5 to 4 min 200° to 210°C b. a. Figure 1. The “standard” reflow profile (a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
) excessive pad size vs. the part’s terminal size, leading to the same effect. Te m p er at ur e (° C ) Preheat Preflow Reflow Cooldown Dwell at Liquidus 20 to 70 sec Dwell at Liquidus 20 to 60 sec 230 230 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 to 3 min 3.5 to 4 min 200° to 210°C b. a. Figure 1. The “standard” reflow profile (a
