Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
: When excep- tionally high ramp rates (e.g., 6° to 7°C/sec) are in effect, the solvents in the paste can boil, creating bubbles with sufficient force to pop components out of place
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/1017.html
static.It can be full panel coating or selective coating.This PCB coating equipment eliminates the microscopic bubbles,common in other sealant applications,and provides a superior moisture barrier
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/981.html
static.It can be full panel coating or selective coating.This PCB coating equipment eliminates the microscopic bubbles,common in other sealant applications,and provides a superior moisture barrier
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/997.html
static.It can be full panel coating or selective coating.This PCB coating equipment eliminates the microscopic bubbles,common in other sealant applications,and provides a superior moisture barrier
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/conductive-adhesive?con=t&page=5
Nordson ASYMTEK A range of dispensing technologies from Nordson ASYMTEK are successfully used in camera module and sensor assembly Medical Device Assembly Using Jet Dispensing for Underfill Applications Nordson ASYMTEK T. Woods & S. Adamson (SMTA, May 2004) (PDF 217 KB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/hot-melt?con=t&page=3
) Hot Melt Solder Mask Product Types View All Fluid Dispensing Systems (8) Dispense Robots (6) Hot Melt Adhesive Dispensing Systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/accessories-kits-and-auxiliary-equipment?con=t&page=20
(SMA) (5) Encapsulant (4) Glue (4) Silicone (4) Thermal Interface Material (TIM) (4) Lubricant (3) Primer (3) Reagent (3) Solder Paste (3) Flux (2) Solder Mask (2) Hot Melt (1) Applications View All Jetting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/about-us/nordson-blog/electronics-solutions-blogs/plasma-surface-preparation
. Surfaces are activated using plasma source gases such as argon, oxygen, hydrogen, or a mixture. The enhanced surface wettability from plasma treatment results in better conformal coating adhesion to high-performance solder mask materials and other difficult-to-adhere-to substrates
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-503.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/news-events-pr-503.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
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