| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other Plastic ICs/PEMs
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: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2470-3v-voids-and-cracks
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Application Notes 3V VOIDS AND CRACKS 3V VOIDS AND CRACKS Ceramic Cutting Tool
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: Test and Inspection IGBT Modules Interrogated Acoustically Nordson SONOSCAN POPCORN CRACK Nordson SONOSCAN Plastic Encapsulated Microcircuit (PEM
