| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23573.chtml
• Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23572.chtml
• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
| http://etasmt.com/te_news_bulletin/2021-08-31/23572.chtml
• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml
• Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope
Heller Industries Inc. | https://hellerindustries.com/nonwetting/
. Process and design-related causes of PCB Nonwetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond
Heller Industries Inc. | https://hellerindustries.com/dewetting/
thin solder film and the base metal is not exposed. Process and design-related causes of PCB Dewetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=12
. The Quadra range provides high magnification X-ray imagery of bumps on wafer, and non-destructive inspection of packages including bond wire integrity, micro-bump quality, contaminated material and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=13
. The Quadra range provides high magnification X-ray imagery of bumps on wafer, and non-destructive inspection of packages including bond wire integrity, micro-bump quality, contaminated material and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-semiconductor?con=t&page=14
. The Quadra range provides high magnification X-ray imagery of bumps on wafer, and non-destructive inspection of packages including bond wire integrity, micro-bump quality, contaminated material and
