ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Side Alignment Camera The side view camera is ideal for testing micro features such as copper pillars, micro bumps and TSVs. The system enables a secondary view point of feature to be tested, providing accurateand repeatable tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/bondtesting-systems
können die anspruchsvollsten Anwendungen wie hochdichte Löt-Bumps oder Mikro-Copper Pillars automatisch testen. Standardmäßig werden alle diese Bondtester mit linearen XY-Encodern von Reinshaw geliefert, welche die beste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/bondtesting-systems
F ully Automated Bondtesters Our automated Bondtesters remove the need for operator intervention. They can automatically test the most demanding applications such as high density solder bumps or micro-copper pillars
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plasma treatment can also perform etchback to expose bumps or copper pillars for WLP as well as panel-level packaging. Die Stacking Many industry leaders are developing stacked WLP to offer inexpensive alternatives to stacked bare-die packages (3D packages
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials
. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials-software
. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4000plus-bondtester
. - Side alignment camera provides a side view, ideal for testing micro features such as copper pillars, micro bumps and TSVs. This secondary view point provides accurate and repeatable tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4800-bondtester
. It is a truly unique quality control tool with each feature design to accurately test semicondutor wafer interconnects such as solder balls, bumps, and copper micro pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=18
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
