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. Bleed Out The interface material migrates out from between two surfaces after a period of use. Bond Line Thickness (BLT) The thickness at which a thermal interface material (TIM
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ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
. The EM-X300 series of materials offers UL 1950 and UL 746 C performance down to a total thickness of 0.009”. These materials use G.E. Valox®
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. When you need to optimize the reflow profile, you need to analyze the board parameters such as board thickness, copper thickness, and components as well as be familiar with your reflow oven’s capability. Keywords
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. Mechanics of Heat Transfer Choosing the best thermal compound requires some understanding of the mechanics of heat transfer and how the thickness of the thermal compound layer, the bond line
