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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/anisotropic-and-isotropic-etch?con=t&page=5
: Anisotropic and Isotropic Etch Plasma for Underfill Process in Flip Chip Packaging Nordson MARCH Using Argon Plasma to Remove Fluorine, Organic and Metal Oxide Contamination for Improved Wire Bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/about-us/nordson-blog/electronics-solutions-blogs/plasma-surface-preparation
changing bulk properties. Plasma surface preparation is widely used in electronic device assembly, printed circuit board (PCB) manufacturing and medical device manufacturing to activate surfaces, improve adhesion, promote fluid flow, and remove contamination
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