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. INTRODUCTION The relationship between voiding and reliability of area array solder joints has been a topic of both study and debate for many years
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. INTRODUCTION The relationship between voiding and reliability of area array solder joints has been a topic of both study and debate for many years
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. Electronics Forums : An online community for members to discuss, advise and debate electronics-related topics. They have a dedicated forum for soldering. EEVblog Electronics Community Forum : Another online community for electronics enthusiasts, with a
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. The exact mechanism for elimination of the formate is still under debate, and one leading theory is sublimation at elevated temperatures [12]. In addition, when heated to above 180°C, formic acid undergoes thermal decomposition [13]. There are two
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