ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2016-06-28
. Visit www.kingplastic.com . PHOTOS ATTACHED: 1. SmartGap™ Die; 2. SmartGap™ Single-Point Adjustment; 3. King StarBoard® application; 4. King ColorCore® application. ### Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1020-voids
image of a COB void (red). Sample & Method Many smart cards and hand-held toys use the COB design, where the die is attached and wire bonded directly to the board, then overmolded
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0540-csp-delaminations
- Application Note 540 Massive delamination shown in red. Sample & Method In this CSP the die is mounted to an elastomer material, which is then attached to a flex substrate with solder balls
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0355-head-sink-and-adhesive
Sink Attach - Application Note 355 Acoustic image showing head sink and adhesive, no significant defects. Sample & Method A flip chip having an adhesively attached heat sink was imaged from the top side at 100 MHz
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/hard-disk-drive
is embedded on HGA to adjust the slider head position precisely on the disk. PZT is the actuator to move the head slightly. Two PZTs are attached on HGA with die attach material
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/mems
. Nordson ASYMTEK customers are using a range of fluid dispensing equipment for applications for MEMS manufacturing. Capping for MEMS and ASIC MEMS die and ASIC are attached and connected with wire-bonds to a substrate
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
) and they have a long list of defects which I’ve attached along with the table of minimum bond strength. 3.2.1 Failure category. Failure categories are as follows
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Calculator-Software-Guide-8201622.pdf
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 THE DATA BASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 DEFINING A PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 DIE SELECTION AND ADJUSTMENT
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Calculator-Software-Guide-8201622.pdf
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 THE DATA BASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 DEFINING A PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 DIE SELECTION AND ADJUSTMENT
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
) and they have a long list of defects which I’ve attached along with the table of minimum bond strength. 3.2.1 Failure category. Failure categories are as follows
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