Partner Websites: die attached (Page 1 of 3)

Die With Innovative Gauge Adjuster Lets Sheet Extrusion Leader King Plastic Maintain Its Strict Stan

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2016-06-28

. Visit www.kingplastic.com . PHOTOS ATTACHED: 1. SmartGap™ Die; 2. SmartGap™ Single-Point Adjustment; 3. King StarBoard® application; 4. King ColorCore® application. ### Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers

ASYMTEK Products | Nordson Electronics Solutions

VOIDS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1020-voids

image of a COB void (red). Sample & Method Many smart cards and hand-held toys use the COB design, where the die is attached and wire bonded directly to the board, then overmolded

ASYMTEK Products | Nordson Electronics Solutions

CSP DELAMINATIONS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0540-csp-delaminations

- Application Note 540 Massive delamination shown in red. Sample & Method In this CSP the die is mounted to an elastomer material, which is then attached to a flex substrate with solder balls

ASYMTEK Products | Nordson Electronics Solutions

HEAD SINK AND ADHESIVE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0355-head-sink-and-adhesive

Sink Attach - Application Note 355 Acoustic image showing head sink and adhesive, no significant defects. Sample & Method A flip chip having an adhesively attached heat sink was imaged from the top side at 100 MHz

ASYMTEK Products | Nordson Electronics Solutions

Hard Disk Drive | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/hard-disk-drive

is embedded on HGA to adjust the slider head position precisely on the disk. PZT is the actuator to move the head slightly. Two PZTs are attached on HGA with die attach material

ASYMTEK Products | Nordson Electronics Solutions

MEMS | Nordson ASYMTEK

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/mems

. Nordson ASYMTEK customers are using a range of fluid dispensing equipment for applications for MEMS manufacturing. Capping for MEMS and ASIC MEMS die and ASIC are attached and connected with wire-bonds to a substrate

ASYMTEK Products | Nordson Electronics Solutions

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

) and they have a long list of defects which I’ve attached along with the table of minimum bond strength. 3.2.1 Failure category. Failure categories are as follows

CF-8 Calculator Software package

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Calculator-Software-Guide-8201622.pdf

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 THE DATA BASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 DEFINING A PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 DIE SELECTION AND ADJUSTMENT

GPD Global

CF-8 Calculator Software package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Calculator-Software-Guide-8201622.pdf

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 THE DATA BASE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 DEFINING A PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 DIE SELECTION AND ADJUSTMENT

GPD Global

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

) and they have a long list of defects which I’ve attached along with the table of minimum bond strength. 3.2.1 Failure category. Failure categories are as follows

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