ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/coating-conformal?page=1
investments, while addressing regulatory and environmental concerns. Traditional methods for applying conformal coatings, such as dipping and air spray, are expensive in terms of materials and labor
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/flux
. As bump sizes decrease, it is more difficult to control dipping operations to consistently deliver smaller amounts of flux. Problems such as too much flux, excessive flux residue, or inconsistent flux application significantly degrade the ability of the underfill encapsulant to uniformly adhere to all surfaces beneath the chip
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pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die-casting, coating Laminating, casting, lamination, foaming, transfer molding, compression molding
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pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die-casting, coating Laminating, casting, lamination, foaming, transfer molding, compression molding
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with sensor 72mm 00141297 72mm feeder Siplace X with sensor 03063461 Siplace Linear Dipping Unit (POP feeder) 00142031 Siplace X vibrating feeder with adopter
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with sensor 72mm 00141297 72mm feeder Siplace X with sensor 03063461 Siplace Linear Dipping Unit (POP feeder) 00142031 Siplace X vibrating feeder with adopter