| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
. Flux residue fractures and its frag- ments attach to a pin. Pin Inhibits flux residue attachment ■ Figure 1. Example of ICT inspection failure ■ Figure 2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4000hs-high-speed-bondtester
manufacture, but never more so than with the introduction of lead-free solder. Although lead-free joints can be stronger, it has been noticed that they are particularly susceptible to brittle fractures at the component interface
| https://www.eptac.com/webinars/page/3
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-2-surface-mount-technology-smt/
. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs
. The defect condition on the page discusses the requirements for all 3 classes and it mentions “…any nicks or chip-out in the termination area, or exposing and electrode, any cracks or stress fractures, or any damage in excess of Table 9-1
| https://www.eptac.com/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs/
. The defect condition on the page discusses the requirements for all 3 classes and it mentions “…any nicks or chip-out in the termination area, or exposing and electrode, any cracks or stress fractures, or any damage in excess of Table 9-1
