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| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. It has been seen, over the years, that BGA components do warp and many times creates shorts in the center of the device itself. Based upon the size of the component, when this happens, the edges of the components are rising up off the surface of the PCB
. Can you explain what the “standard industry practice” is? Read Answer J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Question
| https://www.eptac.com/faqs/ask-helena-leo/page/8
. All references, both personal, professional, and relative to product details will be removed from the discussion. SMT Components During Reflow Float Off Pads QUESTION Question
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
. It has been seen, over the years, that BGA components do warp and many times creates shorts in the center of the device itself. Based upon the size of the component, when this happens, the edges of the components are rising up off the surface of the PCB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
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