| http://etasmt.com/te_news_bulletin/2020-05-13/16161.chtml
. Today we will give you some details about the reflow oven different and how to choose. The purpose of reflow oven is to heat the solder paste, let it melt, and solder the components to the PCB board
| http://etasmt.com:9060/te_news_bulletin/2020-06-08/16961.chtml
. We will calculate how many time mount the chip on one PCB board. 2. According to the speed and time, we can calculate which chip mounter and how many is suitable. 3
| http://etasmt.com/te_news_bulletin/2020-06-08/16961.chtml
. We will calculate how many time mount the chip on one PCB board. 2. According to the speed and time, we can calculate which chip mounter and how many is suitable. 3
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner , PCBA cleaner , Wave Oven Pallet/Fixture cleaner , Mis-Print PCB cleaner , Squeegee cleaner , Nozzle cleaner , PCB surface cleaner and so on
| http://etasmt.com:9060/te_news_industry/2021-09-01/24361.chtml
) to the PCB, the solder paste will stick the SMC/SMD to the PCB. At this status, the solder paste still a mixture with the solder balls and flux
| http://etasmt.com/te_news_industry/2021-09-01/24361.chtml
) to the PCB, the solder paste will stick the SMC/SMD to the PCB. At this status, the solder paste still a mixture with the solder balls and flux
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
5.2.1 Solder a. The supplier shall use solder ribbon, wire and preforms, provided that the alloy and flux conform to the requirements on “material selection” of ECSS‐Q‐ST‐70‐08. NOTE 1 The following solder alloys are approved: • 60 Sn
Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
and manufacturing including Advanced Packaging Technology, Flux, Solder, Adhesives, Inspection Technologies, Manufacturing Excellence, Substrates/PCB Technology, and more
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