Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/
High Density Interconnect (HDI) PCB Technology | Imagineering Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
| https://www.eptac.com/class/ipc-designer-certification
IPC Designer Certification | Online & In-Person | Certified Interconnect Designer Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
Custom Interconnect Limited installiert neuestes Nordson SELECT Novo 460PD Selektivlötsystem SELECT Products Unternehmen | Globales Verzeichnis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
Custom Interconnect Limited Installs Latest Nordson SELECT Novo 460PD Selective Soldering System SELECT Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Overview - All Novo 460 Cerno
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
| https://www.wesource.com/miscellaneous/hpe-sy-300gb-interconnect-link-3m-aoc-876689-b21-id-700114-2/23/
HPE SY 300GB Interconnect Link 3m AOC 876689-B21 ID_700114 (2/23): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/passivation-shear
(such as solder balls) being entrenched up to 10um within the layer. P assivation shear is designed to cut through the layer and only record the shear force from the interconnect of interest
| https://www.eptac.com/wp-content/uploads/eptac/schedules/2020/EPTAC_TrainingSchedule_PCBDesign.pdf
eptacapp.com IPC Certified Interconnect Designer IPC-2221 “Generic Standard on Printed Board Design” IPC-2222 “Sectional Standard on Rigid Organic Printed Boards
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALLEGRO&PN=A5364CA
! customer login required - 1 credit Status: Active Mounting Type: Through-hole Logical Description: IC, Ionization Smoke Detector with Interconnect Physical Description: DIP, 7.62 mm lead span, 2.54 mm pitch; 16 pin, 19.30 mm L X 7.11 mm W X
| http://etasmt.com/cc?ID=te_news_industry,6961&url=_print
. Reflow soldering machine: refers to soldering a solder paste previously coated on a pad by heating to electrically interconnect the leads or solder terminals of the electronic components pre-applied on the pads and the pads on the pcb
