PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1110&OB=DESC.html
previous designer has created blind via (L8-L7) for the 8 layers board with small solder mask opening. The drill for this blind via is 0.1mm, pad is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1110&OB=ASC.html
with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) European Union Directive has significantly reduced the use of tin/lead surface finishes for component terminations. A reexamination of solder joint wetting of lead-free solders with the new component terminations is key to establishing thermal process profiles that ensure acceptable solder joint integrity
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
? Posted on 5st June, 2012 by Mark Pilkington Well I’ve got to say it again, what is wrong with the existence of voids in solder joints
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html
. If I put a via in between the squares of solder paste the pitch is about 1.8mm. This is using the footprint generated from Footprint Expert
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11617.html
. If I put a via in between the squares of solder paste the pitch is about 1.8mm. This is using the footprint generated from Footprint Expert
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11613.html
. If I put a via in between the squares of solder paste the pitch is about 1.8mm. This is using the footprint generated from Footprint Expert
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