Partner Websites: j-std 001 e test (Page 17 of 54)

Gum and Hard Candy at a Workstation - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gum-and-hard-candy-at-a-workstation

: The following is from J-STD-001 D and J-STD-001 E states the same thing. When then say eating and drinking they are talking about having food which is handled like a sandwich or chips, candy bar, all that kind of stuff

Ask Helena & Leo (5)

| https://www.eptac.com/faqs/ask-helena-leo/page/5

. They will tin the wire, set the wire in, press the iron on the... Read More IPC J-STD-001: 5.1.3 Question on Wire Tinning QUESTION Question

When to Tin and Not Tin Wires - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/when-to-tin-and-not-tin-wires

: IPC-J-STD-001 Rev E, page 13, section 5.1.3, “Stranded wire shall not [D1, D2, D3] be tinned when:” Wires will be used in crimp terminations Wires will be used in threaded fasteners Wires will be used in forming mesh splices IPC-A-610 Rev E, page 4-10, Section

Post Lead Trimming Reflow Requirements - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements

. Therefore any cut into the solder joint fillet during lead trimming the solder joint must be reflowed. This is also defined in J-STD-001 in paragraph

What is IPC Compliance? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/what-is-ipc-compliance_topic2232.html

.  The assembly guidelines originate in the IPC-J-STD-001 standard for solder joint acceptability.  The IPC Land Pattern consists of pad size and spacing and all other customization for Drafting Outlines and other preference options are not defined by IPC

PCB Libraries, Inc.

What is IPC Compliance? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/what-is-ipc-compliance_topic2232_post9236.html

.  The assembly guidelines originate in the IPC-J-STD-001 standard for solder joint acceptability.  The IPC Land Pattern consists of pad size and spacing and all other customization for Drafting Outlines and other preference options are not defined by IPC

PCB Libraries, Inc.


j-std 001 e test searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

High Throughput Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

Wave Soldering 101 Training Course
PCB Depanelizers

"Find out how you can receive priority in SMTnet Search with out Sponsor membership."