Partner Websites: j-std 001g cleanliness (Page 1 of 4)

SolderTip #48: The Cleanliness of Wire and Terminal Connections | EPTAC

| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/

capillary action, to wick beneath the wire insulation where the flux residues will remain without the ability of being cleaned away. As called for in J-STD-001, the fluxes have to be qualified to verify the residual residues are not going to be detrimental to the functional operation of the product

SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succe

| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/

capillary action, to wick beneath the wire insulation where the flux residues will remain without the ability of being cleaned away. As called for in J-STD-001, the fluxes have to be qualified to verify the residual residues are not going to be detrimental to the functional operation of the product

SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succe

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections

capillary action, to wick beneath the wire insulation where the flux residues will remain without the ability of being cleaned away. As called for in J-STD-001, the fluxes have to be qualified to verify the residual residues are not going to be detrimental to the functional operation of the product

Ask Helena & Leo (3)

| https://www.eptac.com/faqs/ask-helena-leo/page/3

. J-STD-001, IPC-A-610 and IPC-A-620 all require solder to be “visible” in the inspection hole (if present). Is there a more specific requirement to this

Ask Questions | EPTAC

| https://www.eptac.com/ask/

0.75 ug/cm2, which converts to 4.4 ug/in2, however; IPC 6012 still has the board cleanliness limit for sodium chloride as 1.56 ug/cm2 (10.06 ug/in2). Read Answer Building to IPC-A-610 or J-STD-001 Question

SolderTip #39: Class 2 vs Class 3 Assemblies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-39-class-2-vs-class-3-assemblies/

: Clean vs No-Clean Fluxes SolderTip #40: Component Mounting and Acceptability SolderTip #41: J-STD-001 Revision E is Here – Order it Now! Question :  Can you give me a basic definition of the differences between Class 2 and Class 3 products and where these differences show up in the IPC documents

SolderTips | EPTAC

| https://www.eptac.com/solder-tips/

: Gold Removal and Wave Soldering vs Hand Soldering Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows

62 EWS APEX update

| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf

. Specification task group committees 6. IPC has 405 document listed on its Revision Table www.ipc.org 1. 375 active and 30 obsolete 2 http://www.ipc.org/ J-STD-001/610 • The 001 and 610 are being updated to Rev H and the comments are being handled at the meetings and through zoom meetings and con calls

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CSE.pdf

■ Industry-Demanded Certifications PCB TECHNOLOGY Quality & Inspection ■ IPC-A-610 Instructor & Operator Certification Soldering & Assembly ■ IPC J-STD-001 Instructor

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