Partner Websites: no clean cleanliness requirements (Page 8 of 37)

Footprint For Solderable Jumper? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-for-solderable-jumper_topic2089.html

? In my current footprint there are 2 pads each 0.5 x 1.0mm with a gap of 0.2mm between the 2 long sides. (02.mm Gap due to clearance requirements

PCB Libraries, Inc.

Footprint For Solderable Jumper? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2089&OB=DESC.html

? In my current footprint there are 2 pads each 0.5 x 1.0mm with a gap of 0.2mm between the 2 long sides. (02.mm Gap due to clearance requirements

PCB Libraries, Inc.

Footprint For Solderable Jumper? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2089&OB=ASC.html

: I want something that is easy and quick to connect, but also easy to desolder and clean up for reconfiguration.  If it makes any difference, the intent is to use lead-free solder

PCB Libraries, Inc.

Soldertips (3)

| https://www.eptac.com/faqs/soldertips/page/3

. […] Read More SolderTip #38: Clean vs No-Clean Fluxes General Tip Question:  We are using a Kester 186 RMA Flux for our assembly process

Conformal Coating Equipment

GPD Global | https://www.gpd-global.com/co_website/conformal-simplecoat-specs.php

(0.25") Transport Height 940 mm - 965 mm (37" - 38") Communication SMEMA Facility Requirements Air Supply 6 bar (87 psi) dry, clean air Included

GPD Global

Conformal Coating Equipment

GPD Global | https://www.gpd-global.com/conformal-simplecoat-specs.php

(0.25") Transport Height 940 mm - 965 mm (37" - 38") Communication SMEMA Facility Requirements Air Supply 6 bar (87 psi) dry, clean air Included

GPD Global

Conformal Coating Equipment

GPD Global | https://www.gpd-global.com/conformal-coating-equipment.php

(0.25") Transport Height 940 mm - 965 mm (37" - 38") Communication SMEMA Facility Requirements Air Supply 6 bar (87 psi) dry, clean air Included

GPD Global

Dispense-System-Service-Guide_22290008G.book

GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf

Dispense-System-Service-Guide_22290008G.book Automated Dispense System Service Guide Version 5.2 March 30, 2022 Part No. 22290008G for dispense system models

GPD Global

Accept or Reject: Solder Contacting Component Bodies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/

: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39

Dispense System Service Guide

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf

Dispense System Service Guide Automated Dispense System Service Guide Version 5.1 May 18, 2018 Part No. 22290008G for dispense system models: DS Series

GPD Global


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