Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Additionally, thermally activated diffusion, electromigration, and environmental reactions degrade the semiconductor. Finally, as transistors shrink, they become more sensitive to high temperatures because of increased non- fatal manufacturing defects [1
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/efd-products/fluxplus-paste-flux
27P00 45P00 Aluminum Non-solderable Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel Monel Nichrome Nickel Nickel
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_21_09.pdf
Added moisture sensitive and process sensitive component usage Changed gold removal process Added heat shrinkable soldering devices
: We have a through-hole integrated circuit (IC) component that has good wetting when it goes through the wave soldering machine, and the solder climbs pretty far up the lead
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
: What causes insufficient wetting in soldering? A: Insufficient wetting refers to solder that doesn’t spread evenly across the surface of the joint or
| https://www.eptac.com/ask/pem-nut-soldering-criteria/
. This section describes the wetting of the solder to the physical part and the board itself. Keep in mind however, that a PEM ® nut is inserted into the board with an interference fit, so it will be secure
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cavity-shear
. The typical deformation of gold balls is shown in pictures below. These bonds were non-destructively tested to the mean bond strength, so that the ball is deformed but the bond did not fully fail
| http://etasmt.com/cc?pageID=newsList&ID=te_news_industry,0&pNum=4
... Show Details How to Prevent Non-Wetting Defect during the SMT Reflow Process SMT Reflow Oven, Nitrogen Reflow Oven, Dual Lane Reflow Oven, Vertical Reflow Oven, Vacuum SMT Reflow Oven, Lead free SMT
| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
