Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/sr760-spectrum-analyzer-158192?page=293&order=name+desc
测试仪器 SPECTRUM ANALYZER SR760 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products SPECTRUM ANALYZER Public Pricelist Public Pricelist SPECTRUM ANALYZER
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/n9912a-keysight-fieldfox-handheld-rf-analyzer-4-ghz-221502?page=64&order=list_price+asc
Keysight FieldFox Handheld RF Analyzer, 4 GHz | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Keysight FieldFox Handheld RF Analyzer, 4 GHz Public
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
: SMTA International Abstract: The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
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) Martin Repair BGA Repair Rework Station Denon Instruments DIC Rework SNC100C Solder New (28) 25-Lb Boxes X-Ray / AOI’s: Fein Focus FXS-160.40 X-Ray Phoenix X-Ray Pcbal Analyzer
| http://www.thebranfordgroup.com/dnn3/Auction/DZSF0323.aspx
) Martin Repair BGA Repair Rework Station Denon Instruments DIC Rework SNC100C Solder New (28) 25-Lb Boxes X-Ray / AOI’s: Fein Focus FXS-160.40 X-Ray Phoenix X-Ray Pcbal Analyzer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
(solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2
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Management Team Contact Us Help Subscribe By Order Of: Surplus to the Ongoing Operations of Finisar Corp Package of Electronic Test & Measurement Equipment Keysight, Agilent, HP, JDSU & TDK Gear
