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: Andrew Mawer, Motorola Semiconductor Products, Texas "A Comparison between Power and Thermal Cycling for a FC PBGA" 2003: Paul Wang, Ph.D., Sun Microsystems, Inc
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cable and wire harness assemblies. The more people in your organization understand and apply the IPC 620 standards, the higher the quality of your products will be
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. Requirements for resistance to thermal fatigue are a priority for the products of many high reliability end users [6]. Solder joints age and degrade during service and eventually fail by the wear out mechanism of thermally activated solder fatigue (creep fatigue) [7
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. Requirements for resistance to thermal fatigue are a priority for the products of many high reliability end users [6]. Solder joints age and degrade during service and eventually fail by the wear out mechanism of thermally activated solder fatigue (creep fatigue) [7
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. Requirements for resistance to thermal fatigue are a priority for the products of many high reliability end users [6]. Solder joints age and degrade during service and eventually fail by the wear out mechanism of thermally activated solder fatigue (creep fatigue) [7
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