Partner Websites: rohs bgas (Page 1 of 1)

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. lead-free Many applications have a requirement for use of lead-free solder alloy. Sometimes this is due to the product falling under the RoHS

ASYMTEK Products | Nordson Electronics Solutions

Guia de seleção de solda | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/efd/resource-center/solder-selection-guide

. sem chumbo Muitas aplicações exigem a utilização de ligas de solda sem chumbo. Às vezes, isso se deve ao fato de o produto se enquadrar na diretiva RoHS (Restrição de Substâncias Perigosas

ASYMTEK Products | Nordson Electronics Solutions

Solder Selection Guide | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide

. lead-free Many applications have a requirement for use of lead-free solder alloy. Sometimes this is due to the product falling under the RoHS

ASYMTEK Products | Nordson Electronics Solutions

Auswahlhilfe von Lotprodukten | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/divisions/efd/resources/solder-selection-guide

. Manchmal liegt dies daran, dass das Produkt unter die RoHS-Richtlinie (Restriction of Hazardous Substances) fällt, und manchmal ist es eine Unternehmensrichtlinie

ASYMTEK Products | Nordson Electronics Solutions

RS-1_E_new

| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf

. ●The machine complies with the “JUKI Group Green Procurement Guidelines” on the use of hazardous substances, which is stricter than other restrictions, such as those of the RoHS Directive

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

: Whisker Inspection Results André M. Delhaise, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri Abstract 32-2 Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage Pradeep Lall, Kartik

Surface Mount Technology Association (SMTA)

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