Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5495
: The influence of the electroless deposition of Pd in electroless Ni-P/electroless Pd/immersion Au (ENEPIG) plating was investigated on the reliability of Au and Cu wire-bonding
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will
| https://pcbasupplies.com/alloy-solder-paste-enig/
. Recommended for ENIG finish In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish
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| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/4202.html
: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. PREVIOUS： 03076404-01 NEXT： 03076588-01 RELATED PRODUCTS CATEGORIES ABOUT US
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/PRODUCTSA/PARTS/4202.html
:03076575-01 Description: ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. ISO 14580 - M4 x 18-8.8,cu-pl.,ni-pl. Previous： 03076404-01 Next： 03076588-01 RELATED PRODUCTS CATEGORIES ASM EQUIPMENT Equipment Accessories PANASONIC EQUIPMENT Equipment Accessories YAMAHA EQUIPMENT Equipment Accessories FUJI EQUIPMENT Equipment Accessories JUKI
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
. Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package
