GPD Global | https://www.gpd-global.com/features-contourmap.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself
GPD Global | https://www.gpd-global.com/encapsulation-dispensing-dam-fill.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-encapsulation-application.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/fluid-dispense-encapsulation-application.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/dispensing-underfill-encapsulation-dam-fill.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/heatConfigurations-max2.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
| https://www.eptac.com/faqs/soldertips/soldertip/solder-pot-maintenance-and-dross-removal
. Larger machines tend to generate more dross, so solder levels should continue to be monitored. More SolderTips What’s with the expiration dates on solder paste or wire? Accept or Reject
| https://www.eptac.com/webinars/how-to-create-the-perfect-solder-joint/
& Techniques for Manually Reflowing of Solder Paste DOWNLOAD PDF PRESENTATION WATCH ON DEMAND Course Length: 34 Minutes | Cost: FREE | Presenter: Leo Lambert It is what we strive for in the electronics manufacturing process, the creation of the perfect solder joint
