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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
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Post Lead Trimming Reflow Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
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