GPD Global | https://www.gpd-global.com/co_website/syringe-heater.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/syringe-heater-max2.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/syringe-heater.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/dispense-system-syringe-heater-pump.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
| https://pcbasupplies.com/thermaltronics-m8ds526-knife-4-83mm-0-19-increased-tin-area-5-84mm-0-23/
. 800 Series tips designed for high thermal demand soldering applications. For use with Thermaltronics TMT-9000S, Metcal MX-500, MX-5000 & MX-5200 systems
| http://etasmt.com/cc?ID=te_news_industry,24568&url=_print
) is a common gas used for this purpose. This minimizes oxidation of the surfaces to be soldered. The nitrogen reflow oven takes a few minutes to reduce Oxygen concentration to acceptable levels within the chamber
| http://etasmt.com/cc?ID=te_news_bulletin,12961&url=_print
: The effective utilization and thermal compensation efficiency, it needs less than 20 minutes from temperature control accuracy ± 1 °C ambient temperature to a temperature stabilization
| http://etasmt.com/te_news_bulletin/2013-03-05/2761.chtml
. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
| http://etasmt.com:9060/te_news_bulletin/2013-03-05/2761.chtml
. Enclosed voids can cause a displacement of electrical and thermal paths as well as a local concentration of power and heat. Additionally, gas voids are quick to form spheres in the solder gap, which could cause the tilting of chip components and a wedge-shaped solder gap
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Issues Caused by Voids Reduced adhesion of device to substrate Reduced thermal performance Electrical failures from “solder creep” Lower reliability & shorter lifetime Pressure Curing Removes Voids As pressure is increased, more gas molecules are able to dissolve
