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:13am Hi, In a QFN footprint with a thermal pad in the center. Is there a reason why we should not include the n vias in the thermal pad already in the footprint
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:13am Hi, In a QFN footprint with a thermal pad in the center. Is there a reason why we should not include the n vias in the thermal pad already in the footprint
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: Thermal Compounds Quality and Reliability Investigation of Printed Circuit Board Micro-vias by X-ray Inspection Nordson DAGE NondestructiveBondlineMeasurementinAdvancedFlipChips_APWebsite1_9_08
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Posted: 20 May 2021 at 12:15pm What happens to the paste mask flow into via holes is that since the vias are connected to the GND planes with direct connections (no thermal reliefs
