| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
Tempered Leads, Class 3 Rework, Toe Fillets and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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Tempered Leads, Class 3 Rework, Toe Fillets and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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#1 Cleaning Methods The cleaning process must be based upon the flux types being used Entrapment areas must be checked 7 #2 Toe Fillets The main question is
| https://www.eptac.com/webinars/top-5-manufacturing-issues-for-august-2009/
. Topics we will be reviewing are: The confusion behind Toe Fillets. Securing components with adhesive in Class 3. What does “wetting is evident” really mean? SIR testing (IPC 2.6.3.3) methods and their application
| https://www.eptac.com/webinars/top-5-manufacturing-issues-for-august-2009
. Topics we will be reviewing are: The confusion behind Toe Fillets. Securing components with adhesive in Class 3. What does “wetting is evident” really mean? SIR testing (IPC 2.6.3.3) methods and their application
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_does-capacitor-height-affect-pad-geometry_topic2366.xml
:12amIf I interpret IPC7351 correctly, then the design approach for chip components is using the actual exposed lead size and adding toe/heel/side fillets to
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document revisions, but additional requirements not previously mentioned in the existing standards. Learn More Tempered Leads, Class 3 Rework, Toe Fillets and More Length
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html
: 4 Post Options Post Reply Quote dbrgn Report Post Thanks(0) Quote Reply Posted: 03 Feb 2019 at 6:12am If I interpret IPC7351 correctly, then the design approach for chip components is using the actual exposed lead size and adding toe/heel/side fillets to that